Reducing Loadline Impedance in a System

ABSTRACT

In one embodiment, the present invention includes a method of mounting a semiconductor device to a first side of a circuit board; and mounting at least one voltage regulator device to a second side of the circuit board, the second side opposite to the first side. The voltage regulator devices may be output filters, inductors, capacitors, and the like. In certain embodiments, the devices may be located directly underneath the semiconductor device.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.11/588,682, filed on Oct. 27, 2006, which is a divisional of U.S. patentapplication Ser. No. 10/892,804, filed on Jul. 16, 2004, which issued asU.S. Pat. No. 7,145,782 on Dec. 5, 2006.

BACKGROUND

The present invention relates to voltage regulators (VRs), and morespecifically to placement of VR components in a system.

Voltage regulators are used in systems such as a personal computer (PC)(e.g., a desktop computer, server computer, notebook computer and thelike) to receive input direct current (DC) voltages of a given voltageand convert and regulate such DC voltages to one or more regulatedvoltage levels required by various system components, such as integratedcircuits (ICs) and the like.

In a typical system, for example, a desktop PC, a motherboard is used tosupport various system components, including ICs, connectors, VRcomponents, and the like. Such VR components may include outputinductors, bulk capacitors, metal oxide silicon field effect transistors(MOSFETs), driver ICs, and the like. Typically, the VR components areplaced on a primary side (e.g., a topside) of the motherboard. These VRcomponents must be placed outside an IC device's keepout zone (i.e., theIC's footprint, including any socket or heatsink retention). Thisplacement can result in larger loadline lengths and therefore higherloadline impedance (i.e., capacitance, inductance, and resistance). Insuch manner, VR components may be located many centimeters away from anintended load (e.g., an IC). Accordingly, motherboard/package lateraltravel dominates, increasing loadline length and therefore impedance.

Instead of the above described placement of VR components, other systemsuse some type of additional VR daughter module (i.e., a separate circuitboard) that is plugged into the motherboard or an IC device. However,such additional circuit boards increase cost and complexity, and furtherincrease the size of a given form factor. Furthermore, such designstypically provide inferior performance. A need thus exists to provide VRcomponents that have reduced loadline length and impedance.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of a circuit board of a system inaccordance with one embodiment of the present invention.

FIG. 2 is a plan view of a layout of a circuit board having anintegrated circuit and voltage regulator components in accordance withone embodiment of the present invention.

FIG. 3 is a close-up view of a portion of the circuit board of FIG. 2.

DETAILED DESCRIPTION

In various embodiments of the present invention, different components ofa voltage regulator may be coupled to a secondary side of a circuitboard, such as a motherboard. More specifically, such components may beplaced within a keepout zone of an IC located on the primary side of thecircuit board. For example, a processor of a system may be coupled to amotherboard by a socket. Such a socket may have a keepout zoneassociated therewith on the primary side that prevents any othercomponent from being located within the keepout zone. Thus, by locatingone or more voltage regulator components on a secondary side of thecircuit board, such components may be located closer to their load(i.e., the microprocessor) than if the components were located on theprimary side of the circuit board. In such manner, a substantiallyshorter loadline and therefore a smaller loadline impedance may beaccommodated.

While the types of components that may be placed on the secondary sidemay vary, in certain embodiments such components may include outputinductors, board bulk and high-frequency (HF) capacitors, and one ormore MOSFETs. Such location of voltage regulator components may improvecurrent and voltage transients, provide for better power deliveryefficiency, and lower operating temperatures for a voltage regulator.Furthermore, such location may also enable operation at higher currentlevels. Further, by providing such components on a secondary side of acircuit board, additional space may be open on the primary side, whicheither frees up space or permits use of a smaller circuit board tosupport all desired components.

Referring now to FIG. 1, shown is a cross-sectional view of a circuitboard of a system in accordance with one embodiment of the presentinvention. As shown in FIG. 1, circuit board 20 may support multiplecomponents. As shown in FIG. 1, some components may be surface mountedonto the circuit board, while others may be mounted by use of conductivethrough-holes within the circuit board. Circuit board 20 may be anydesired circuit board, such as a motherboard of a PC. For example,circuit board 20 may be a four-layer motherboard for a desktop computer,although the scope of the present invention is not so limited.

As shown in FIG. 1, a primary side (i.e., the upper side) of circuitboard 20 supports a semiconductor device 30 (also referred to herein as“IC 30”), which may be coupled to circuit board 20 via a package 35.Package 35 may provide connections to pins of semiconductor device 30.In one embodiment, semiconductor device 30 may be a microprocessor, suchas a central processing unit (CPU) of the system. In turn, package 35may be coupled to a socket 38 that may be formed of a housing thatincludes conductors to couple connections from semiconductor device 30to connections on circuit board 20.

An integrated heat spreader 37 may be mounted to package 35 (e.g., viaan epoxy) and coupled to semiconductor device 30 to aid in cooling. Inturn, a heat sink (not shown in FIG. 1) may be coupled to integratedheat spreader 37 to provide heat dissipation. Such a heat sink mayprovide retentions to circuit board 20. As shown in FIG. 1, package 35may form a keepout zone. That is, the dimensions of package 35 define anarea within which components typically cannot be mounted on circuitboard 20.

To reduce loadline impedance and provide better voltage regulatoroperation, multiple voltage regulation components may be coupled to asecondary side (i.e., the lower side) of circuit board 20. As shown inFIG. 1, such components may include a plurality of bulk capacitors 41and a plurality of output inductors 46. Collectively, capacitors 41 andinductors 46 may form one or more output inductor-capacitor (LC) filtersused as output filters for a voltage regulator. Such a voltage regulatormay be a single regulator with multiple phases. In other embodiments,multiple regulators may be present, each having multiple phases. Incertain embodiments, such an LC filter may be located directly undersemiconductor device 30 and may provide a relatively short low impedancepath to the load. In some embodiments such an impedance path may be onlya few millimeters, for example, between two and five millimeters.

Further shown in FIG. 1, the secondary side of circuit board 20 maysupport multiple MOSFETs 51 b. In certain embodiments, MOSFETs 51 b mayact as synchronous FETs (SYNC FETs) that may be used in setting up andcontrolling a pulse width modulation (PWM) of the voltage regulator.While these secondary side components are shown for purposes ofillustration in FIG. 1, it is to be understood that in other embodimentsmore, fewer or different components may be located on a secondary sideof a circuit board and substantially within or near a keepout zone of anIC on the primary side.

Still referring to FIG. 1, additional components may be located on theprimary side of circuit board 20. Such components may include aplurality of HF capacitors 44 that may act as decoupling capacitors.Further, a plurality of MOSFETs 51 a may be located at an immediateperiphery of package 35. Such MOSFETs 51 a may be control FETs (CTRLFETs) used in controlling the PWM of the voltage regulator. Furthercomponents may include bulk capacitors 55 a and 55 b that may be used tofilter incoming unregulated voltages to circuit board 20. In otherembodiments, SYNC FETs 51 b maybe on the primary side of a circuit boardand CTRL FETs 51 a may be on the secondary side. In still otherembodiments, both types of FETs may be present on a secondary side of acircuit board.

Further shown in FIG. 1 is a connector 60 that is coupled to receive oneor more source voltages, for example, from a power supply of the system.Such voltages may then be converted to voltages used by components oncircuit board 20. For example, a 12 volt level may be converted to alower voltage, such as a 1.3 or 0.9 volt level used by a microprocessor.

Referring now to FIG. 2, shown is a plan view of a layout of a circuitboard having an integrated circuit and voltage regulator components inaccordance with one embodiment of the present invention. In theembodiment of FIG. 2, the VR components may be associated with amultiple phase voltage regulator, and more specifically a six-phaseregulator, although the scope of the present invention is not solimited.

As shown in FIG. 2, IC 30 may be mounted to package 35, which in turnmaybe mounted via a socket (not shown in FIG. 2) and a retentionmechanism 36 to a top side of a circuit board 20. Interconnects of IC 30may form a pin field within the boundaries of IC 30. IC 30 may havepackaging in accordance with a land grid array (LGA) type package,although the scope of the present invention is not so limited. Forexample, in other embodiments, a ball grid array (BGA) package or a pingrid array (PGA) package may be used. The term “pin” is used herein torefer to any type of interconnect, and it is to be understood that suchinterconnects may be pins, balls, pads or other types of interconnects,in different embodiments.

Still referring to FIG. 2, IC 30 may be supported and coupled to apackage 35 that in turn is coupled via board retention 36 to circuitboard 20. While not shown in FIG. 2, it is to be understood that anintegrated heat spreader may support heat sink and otherthermomechanical components.

As shown in FIG. 2, various voltage regulator components may bepositioned on a secondary side of motherboard 20, and certain of thesecomponents may be located within the keepout zone of package 35. Forexample, a plurality of synchronous MOSFETs 51 b may be located on thesecondary side. Furthermore, a plurality of output inductors may belocated on the secondary side at a substantial periphery of pin field33. Note for ease of illustration only pads 46 of a single inductor isshown in FIG. 2. Furthermore, bulk capacitors 41 may be coupled to thesecondary side. As shown, bulk capacitors 41 may be located directlyunderneath IC 30 but outside of its pin field, in the embodiment of FIG.2. Such bulk capacitor placement in general may improve VR stability.

Additional voltage regulator components that may be located on thesecondary side may include a plurality of HF decoupling capacitors, oneof which is shown in FIG. 2 as HF capacitor 43. As will be discussedbelow, such capacitors may be positioned between multiple planes ofcircuit board 20. Additional HF capacitors 44 may be coupled to aprimary side of circuit board 20. Specifically, as shown in FIG. 2,primary side HF capacitors 44 may be located directly under the pinfield (and substantially in the middle thereof), and in an unpopulatedportion of the pin field.

Other voltage regulator components may be coupled to the primary side ofcircuit board 20. Such components may include a plurality of CTRLMOSFETs 51 a, which may be coupled just outside a keepout zone ofpackage 35. As shown, such CTRL MOSFETs 51 a may be locatedsubstantially adjacent to SYNC MOSFETs 51 b (although on the other sideof circuit board 20).

Further shown in FIG. 2 are shaded regions corresponding to differentplanes of circuit board 20. Such planes may be various layers of circuitboard 20 and corresponding interconnects of the pin field. Whilereferred to herein as “planes” of circuit board 20, it is to beunderstood that such planes have corresponding areas in the pin field.As shown in FIG. 2, such planes may include a PWM plane 21 that may beused to couple CTRL MOSFETs 51 a to corresponding SYNC MOSFETs 51 b, aground plane 22 and a Vcc plane 23 (i.e., a supply voltage plane). Asshown in FIG. 2, PWM plane 21 may have an area that extends from aperiphery of ground area 22 to couple SYNC MOSFETs 51 b to CTRL MOSFETs51 a.

As shown in FIG. 2, the pin field may be formed of highly consolidatedpower and ground areas with substantial crenellations therebetween.Ground plane 22 may be situated substantially around a periphery of thepin field of IC 30. Ground plane 22 may have a plurality ofcrenellations formed therein that provide extensions to abut portions ofPWM plane 21 on a peripheral side, and on a proximal side suchcrenellations may abut a similar crenellated pattern of Vcc plane 23. Insuch manner, ground plane 22 acts as an intermediate area between Vccplane 23 and PWM plane 21, and ground plane 22 acts as a moat around Vccplane 23.

In one embodiment, output inductors may have dimensions of approximately0.25 inches by 0.25 inches, although the scope of the present inventionis not so limited. As shown in FIG. 2 (and in a close-up in FIG. 3), insuch an embodiment a PWM side inductor pad 46 (in FIG. 2) sits justoutside pin field 33, while a Vcc side inductor pad 46 (in FIG. 2) sitswithin pin field 33. The crenellations provide a connection to suchinductors and also provide a better opportunity to place HF decouplingcapacitors directly between the Vcc input and the ground return planes.

Still referring to FIG. 2, the overall VR loadline may be reduced byplacing SYNC FETs 51 b on the secondary side within the keepout zone ofpackage 35. Since the socket to SYNC FET conduction path should carryroughly as much current as the Vcc line, such placement may have asubstantial impact on reducing the overall loadline. Due to spaceconstraints, this embodiment may place CTRL FETs 51 a on the primaryside outside the socket keepout zone, although the scope of the presentinvention is not so limited.

Referring now to FIG. 3, shown is a plan view of circuit board 20 ofFIG. 2 and components attached thereto. More specifically, FIG. 3 is aclose-up of the embodiment of FIG. 2. FIG. 3 shows in more detail aportion of the crenellation pattern between Vcc plane 23 and groundplane 22. As shown in FIG. 3, the crenellations may be of asubstantially identical depth and width. While shown in the embodimentof FIG. 3 as being four socket pins deep and four (and five) socket pinswide, it is to be understood that the scope of the present invention isnot so limited, and different crenellation patterns may be present indifferent embodiments. As shown in FIG. 3, the pin field may be formedof a plurality of primary side socket pins 36 (one of which isdesignated reference number 36 in FIG. 3).

Also shown in FIG. 3 are various voltage regulator components coupled toboth the primary and secondary sides of circuit board 20. The primaryside components include HF capacitors 44 within Vcc plane 23. Secondaryside components include HF capacitors 43 which as shown, are locatedbetween Vcc plane 23 and ground plane 22. Placement of the HF capacitorswithin the pin field may improve performance by lowering the capacitors'parasitic loadline. Similarly, output inductors 47 (one of which isshown for illustration in FIG. 3) may be located such that a PWM sideinductor pad 46 a is located just outside of the pin field, while theVcc side inductor pad 46 b sits within the pin field, and morespecifically within Vcc area 23. Note pads 46 a and b are shown coupledto a top inductor in FIG. 3.

Thus by placing key VR components on the motherboard's secondary side,VR components may be located substantially underneath an IC device. As aresult, the loadline length may be significantly shorter, resulting in asubstantial drop in loadline impedance from the VR to the IC device.This reduction may result in better current and voltage transients,better power delivery efficiency and lower VR temperatures. It may alsohelp enable higher current levels (e.g., approximately 150 amperes andmore, in certain embodiments).

Also, in systems where form factor is important, VR component placementin accordance with an embodiment of the present invention may free upmore motherboard space, due to the movement of key VR components to thesecondary side and underneath the socket keep-out.

While the present invention has been described with respect to a limitednumber of embodiments, those skilled in the art will appreciate numerousmodifications and variations therefrom. It is intended that the appendedclaims cover all such modifications and variations as fall within thetrue spirit and scope of this present invention.

What is claimed is:
 1. A semiconductor device comprising: a package; anda plurality of interconnects forming an interconnect field coupled tothe package, the plurality of interconnects comprising: a first set ofinterconnects located at an interior portion of the interconnect fieldto connect to a first voltage; and a second set of interconnects locatedsubstantially around the first set of interconnects to connect to asecond voltage.
 2. The semiconductor device of claim 1, wherein thefirst set of interconnects and the second set of interconnects abut witha substantially crenellated pattern.
 3. The semiconductor device ofclaim 1, wherein the first voltage comprises a power supply voltage andthe second voltage comprises a reference voltage.
 4. The semiconductordevice of claim 1, wherein the package is coupled via a socket to aprimary side of a circuit board, the circuit board having a plurality ofvoltage regulator components on a secondary side of the circuit board.5. The semiconductor device of claim 4, wherein the plurality of voltageregulator components comprise output filters located substantiallyunderneath the socket.
 6. The semiconductor device of claim 4, whereinat least one inductor is coupled to the secondary side of the circuitboard and between a pulse width modulation plane and a supply plane ofthe circuit board.